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Macroblock Inc. Announces 1st Quarter Results of 2009 at Investor Conference Held by GTSM on April 29, 2009 - Hsinchu, Taiwan—Macroblock, a leading manufacturer of LED driver, today released its annual results of fiscal year 2008 and the first quarter results of 2009. The gross profit margin in the first quarter of 2009 outperformed that of the same period of last year.

SST Reports First Quarter 2009 Financial Results - News Release For More Information Contact: Leslie Green Green Communications Consulting, LLC (650) 312-9060 SUNNYVALE, Calif., April 28, 2009 -- SST (Silicon Storage Technology, Inc.

Dynex Announces Advance Payment from CSR Times Electric - Lincoln, England, February 6th, 2009 – Dynex Power Inc., a leading specialist high power semiconductor company, today announced that its UK subsidiary, Dynex Semiconductor Ltd., has agreed new distributor arrangements with CSR Times Electric.

Green Packet and GCT Semiconductor Join Forces to Develop World's First Automated Wireless Roaming Solution - Green Packet and GCT Semiconductor Join Forces to Develop World's First Automated Wireless Roaming Solution Business Wire -- April 28, 2009 GCT's Single-Chip Dual-Mode Solution Combined With Green Packet's Connection Manager Software Designed to Offer a Truly Seamless WiFi to WiMAX User Experience...

UMC Board of Directors Important Announcement - Taipei, Taiwan, R.O.C. - April 29, 2009 - United Microelectronics Corporation (NYSE: UMC, TSE: 2303), ("UMC") convened its 19th session, 10th term of its Board of Directors meeting today.

UMC, Springsoft Support Custom Chip Design with 65nm Process Design Kit - Companies deliver foundry-certified Laker-UMC PDK to streamline implementation and manufacturing of leading-edge IC designs Hsinchu, Taiwan, April 27, 2009 -UMC (NYSE: UMC; TSE: 2303), a leading global semiconductor foundry, and SpringSoft, Inc.

UMC Recognized for Excellence by Texas Instruments - HSINCHU, Taiwan, April 27, 2009 -UMC (NYSE: UMC; TWSE: 2303), a leading global semiconductor foundry, announced that the company was formally presented with a Texas Instruments (TI) 2008 Supplier Excellence Award during a special ceremony held today between executives from TI and UMC.

AMD Joins Microsoft® System Center Alliance - — Development continues on DASH plug-in for Microsoft System Center Configuration Manager to enable secure, remote out-of-band management for business PCs — Microsoft Management Summit, LAS VEGAS -- April 28, 2009 --Today AMD (NYSE: AMD) announced its membership in the Microsoft System Center...

MoSys, Inc. Reports First Quarter 2009 Financial Results - | RSS Feeds | E-mail Alerts | View...

Spansion Garners Highest Score of All Semiconductor Suppliers, Receives Top Honor From Stack International - SUNNYVALE, Calif., April 27, 2009 /PRNewswire-FirstCall via COMTEX News Network/ -- Spansion Inc.

ZTE Partners with Semtech on IEEE1588v2 Products for WiMax Basestations, IP Backhaul and Femtocells - ACS95xx ToPSync™ Platform Enables IP Backhaul in Building Femtocells and Other TDM-IP Synchronization Applications Camarillo, California - April 27, 2009 Semtech Corp. (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced that ZTE Corp.

Ericsson and MobiCom bring mobile broadband to Mongolia - Mongolian operator MobiCom has launched the first high-speed mobile broadband network in the country, powered by HSPA technology from Ericsson (NASDAQ:ERIC).

13 Apr 2009 - Freescale Semiconductor Schedules First Quarter 2009 Results Conference Call - AUSTIN, Texas - April 13, 2009 - Freescale Semiconductor will announce its first quarter financial results in a press release at 3:00 p.m. CDT, Wednesday, April 22, 2009. The press release will be posted at www.freescale.com/investor.

Analog Devices and Infineon to Collaborate on Next-Generation Automotive Airbag Safety System - Norwood, Mass., USA and Neubiberg, Germany – April 27, 2009 – Analog Devices, Inc.

Executive Appointment - ...

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Microchip Launches Capacitive Touch Eval Kit

Microchip Launches Capacitive Touch Eval Kit

Editorial Contact: Reader/Literature Inquiries: Michelle Ragsdale 1-888-MCU-MCHP 480-792-4111 http://www.microchip.com/mtouch michelle. [Read more...]

 

Bel Power Selects Microchip's Op Amp & MCU for Power Supply

12.08.2008 19:30 - Source: Microchip Technology

Editorial Contact:

Reader/Literature Inquiries:

Michelle Figor

1-888-MCU-MCHP

480-792-4111

www.microchip.com/power

michelle.figor@microchip.com

 

Bel Power Selects Microchip Technology’s

MCP6291 Op Amp and 8-bit PIC® Microcontroller

for DC-to-DC Power Supply

CHANDLER, Ariz., August 11, 2008 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller and analog semiconductors, today announced that Bel Power Inc. has selected its MCP6291 low-power, high-bandwidth operational amplifier (op amp) and PIC12F675 microcontroller (MCU) for its next-generation Power over Ethernet (PoE) half-brick DC-to-DC converter. The op amp is part of the current-sensing circuit in the converter; while the 8-bit PIC® MCU provides system monitoring, fault detection and correction, and automated functions. Bel Power selected Microchip because of its broad product portfolio, excellent development tools and superior technical support.

Bel Power, a division of Bel Fuse Inc., designs and manufactures a broad range of high-quality, isolated and non-isolated DC-to-DC converters. The MCP6291 op amp was chosen for its next-generation POE power supply because of its availability in many industry-standard packages, its extended temperature range and Microchip’s short lead time. The programmability of the Flash PIC12F675 MCU enables Bel Power to modify the system behavior to meet specific customers’ needs. The advantage of a programmable MCU is that changes can be executed in firmware, without the need for in-circuit component value changes and PCB spins.

Mark Masera, engineering director with Bel Power, said, “Because of the breadth of Microchip’s analog and digital components—from basic op amps, to temperature sensors, to sophisticated MCUs—and their superior levels of technical support, we are compelled to use their products. Additionally, as power density continues to climb, we are forced to consolidate the housekeeping functionality required by a converter into one device that can manage these features. Microchip’s PIC MCU, op amp and related support allow us to do all of this in a timely, flexible and cost-effective manner.”

Mark Jutras, general manager of Bel Power, continued, “Bel Power requires global logistical support for multiple design and manufacturing locations. Microchip consistently delivers technical and sales support to our facilities in the U.S., as well as in China.”

“Microchip’s low-power, high-bandwidth op amps, with availability in small packages and extended temperature range operation capabilities, have developed a reputation for standing above the competition for a wide range of customer applications,” said Rich Simoncic, vice president of Microchip’s Analog and Interface Products Division. “Positive feedback from a leading company like Bel Power validates Microchip’s focus on solving both analog and digital design challenges.”

“The small footprint, integrated analog capability and low cost of the PIC12F675 MCU enables Bel Power to replace many discrete components in their design, which reduces the board footprint, increases design flexibility and reduces overall system costs,” said Steve Drehobl, vice president of Microchip’s Security, Microcontroller and Technology Development Division.

For further information, contact any Microchip sales representative or authorized worldwide distributor, or visit Microchip’s Online Power Design Center at www.microchip.com/power.

Note: The Microchip name and logo, and PIC are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are the property of their respective companies.

**Photos available through editorial contact**

Original text is here