	Electronic Engineering News Digest
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Ericsson strengthens Managed Services capabilities in the IT area - Ericsson (NASDAQ:ERIC) today announced an extension of its global capabilities in the IT domain.

Ericsson signs GSM/EDGE contract with Digicel in Honduras - Ericsson (NASDAQ:ERIC) has been awarded a GSM/EDGE contract by Digicel Group in Honduras, making Ericsson the preferred supplier for Digicel's operations in the Caribbean, El Salvador and now in Honduras.

Microchip Promotes Eric Bjornholt, Lauren Carr and Pete Zimmer to Vice President - Editorial Contact: Reader/Literature Inquiries: Eric Lawson 1-888-MCU-MCHP 480-792-7182 www.microchip.com eric.lawson@microchip.com Microchip Technology Promotes Eric Bjornholt, Lauren Carr and Pete Zimmer to Vice President CHANDLER, Ariz.

Microchip Technology to Present at the JPMorgan 36th Annual Technology Conference - INVESTOR RELATIONS CONTACT: Deborah Wussler ……… (480) 792-7373 MICROCHIP TECHNOLOGY TO PRESENT AT THE JPMORGAN 36TH ANNUAL TECHNOLOGY CONFERENCE CHANDLER, Arizona – May 19, 2008 -- (NASDAQ:MCHP) – Microchip Technology Incorporated, a leading provider of microcontroller...

Cypress and UICO Team Up To Deliver Innovative Electronic User Interface Solutions For Appliance, Medical, and Industrial Markets - - UICO to Employ Cypress CapSense™ and Other PSoC® Technologies For Turnkey, Warranted Interface Solutions SAN JOSE, Calif., May19, 2008 - Cypress Semiconductor Corp.

Infineon Introduces DECT 6.0 / CAT-iq Chipset with Texas Instruments’ Puma 5 DOCSIS 3.0 Cable Modem Solution - Neubiberg, Germany and New Orleans, USA – May 19, 2008 – Infineon Technologies AG (FSE/NYSE: IFX) announced, today at the 2008 Cable TV Show, a cost-effective DECT solution, which when combined with a DOCSIS® 3.

Altera’s Quartus II Software Version 8.0 Delivers Unprecedented Performance and Productivity for High-End FPGAs - Performance, Logic Utilization and Compile-Time Advantages Enable Fastest Time to Market and Efficient Team-Based Design San Jose, Calif.

Fairchild Semiconductor and Zilker Labs Enter Into a Partnership to Provide Point-of-Load Digital Power Products for Communication and Computing Applications - Fairchild Semiconductor (NYSE: FCS), a leading global supplier of high performance products that enable energy-efficiency, and Zilker Labs, a leading provider of high-efficiency digital power ICs, have entered into an agreement to manufacture and sell digital power products, including point-of-load power devices, targeted at the server, networking, graphics and high-end desktop applications.

Fairchild Semiconductor Closes on $150 Million Incremental Term Loan - Fairchild Semiconductor (NYSE: FCS) announces that it has successfully raised an additional $150 million under its existing senior credit facility.

Lattice Semiconductor Appoints Byron Milstead Corporate Vice President And General Counsel - Lattice Semiconductor (NASDAQ: LSCC) today announced the appointment of Byron Milstead as Corporate Vice President and General Counsel.

Cree Announces Extension and Increase of Stock Repurchase Program - DURHAM, N.C., MAY 15, 2008 – Cree, Inc. (Nasdaq: CREE), a market-leading innovator of lighting-class LEDs, LED lighting retrofit solutions, and semiconductor solutions for backlighting, wireless and power applications, today announced that its board of directors approved the extension of the company’s stock repurchase program through the fiscal year ending June 28, 2009. The board also approved an increase in the number of shares the company is authorized to repurchase under the program. As of May 15, 2008, the company is authorized to repurchase up to 5,000,000 shares. The company has repurchased 1,567,500 shares during the current quarter.

Tyco Electronics Continues Leadership Role In The Development Of Broadband Component Technology With New WiMax Dual SPDT Switch - LOWELL, Mass. - April 8, 2008 - Tyco Electronics today introduced a new low-cost, RoHS compliant, dual SPDT switch die for broadband applications that require high linearity, low insertion loss and high isolation. The M/A-COM MASW-008206-000DIE is intended for 802.11a, 802.

Ericsson wins WCDMA/HSPA expansion contract with Sunrise in Switzerland - Ericsson (NASDAQ:ERIC) has signed an agreement with the Swiss operator Sunrise Communications (Sunrise) to expand its WCDMA/HSPA network. The deal will bring high-speed mobile broadband coverage to Sunrise subscribers in a number of cities across Switzerland.

Ericsson to expand and enhance SingTel's GSM/WCDMA/HSPA mobile network in Singapore - Ericsson (NASDAQ:ERIC) has been selected by Singapore Telecommunications Limited (SingTel) to expand and enhance its GSM/WCDMA/HSPA networks, providing the operator's mobile customers with greater coverage and higher data speeds. The contract is worth US$160million.

IPC holds July symposium on electronics and the environment - The Association Connecting Electronics Industries (IPC) will hold a Symposium on Electronics and the Environment in Cambridge, Mass. on July 16 &nd...

Vishay Wins 2008 EE Times ACE Award in Ultimate Products of the Year, Analog ICs Category

Vishay Wins 2008 EE Times ACE Award in Ultimate Products of the Year, Analog ICs Category

The Vishay Siliconix SiP12510 and SiP12511 are 1.25-MHz current-mode boost converters with a feedback reference voltage of 0.1 V. Their typical efficiency of 90 % is the highest ever achieved for this device type. [Read more...]

Cypress to Host Annual Stockholder Meeting on May 9

07.04.2008 09:30 - Source: Cypress Financial PR

SAN JOSE, Calif., April 7, 2008 - Cypress Semiconductor Corp. (NYSE: CY) announced today that it will host its Annual Stockholders Meeting on Friday, May 9 at 10:00 a.m. PDT at Cypress's headquarters, 198 Champion Court in San Jose, Calif.

Stockholders as of our March 11 record date who are interested in attending this event should contact 408-943-2113 to confirm their attendance. The event will also be broadcast live over the Internet and can be accessed through Cypress's web site at http://www.cypress.com/investors. Archived presentations will be available for two weeks immediately following the event.

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