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Electronic Engineering News Digest |
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Toshiba develops cost competitive MEMS packaging technologies--Achieving world’s thinnest multi-chip MEMS package with control IC-- TOKYO--Toshiba Corporation today announced two optimized packaging technologies for micro electro-mechanical systems (MEMS) semiconductor packages that achieve significant cost reductions. [Read more...] |
The Association Connecting Electronics Industries (IPC) will hold a Symposium on Electronics and the Environment in Cambridge, Mass. on July 16 – 17. Speakers include a mix of experts from OEMs, EMS companies, PCB manufacturers, industry suppliers, academia and government officials.
A focus on halogen free
Speakers will discuss what major OEMs are doing to eliminate brominated flame retardants, PCVs and other halogen containing materials from their products. IPC notes that the halogen-free movement will have a monumental effect on the materials, processes and products provided by the supply chain. In this follow-up to the January Intel/IPC Halogen-Free Symposium, OEMs and members of the supply chain will outline their efforts, goals and technological challenges in developing halogen-free electronics.
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