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Cypress's OvationONS™ II Laser Navigation System-on-Chip Selected by Sunrex for Trackball Applications - Programmable Solution Delivers High-Precision Tracking and System Integration SAN JOSE, Calif., June 2, 2008 - Cypress Semiconductor Corp. (NYSE: CY) today announced that computer input device manufacturer Sunrex Technology Corp.

GCT Semiconductor and ASUS Demonstrate Notebooks with Built-in Mobile WiMAX Capability at WiMAX Expo Taipei - ASUS' Notebooks Integrate GCT's GDM7205 - The Industry's First Mobile WiMAX IEEE 802.16e Wave 2 Compliant 2.5 GHz Monolithic Single-chip Solution - Enabling Extensive Connectivity, Dynamic Data Transfer and Longer Battery Life.

Analog Devices Announces Conclusion And Final Settlement Of SEC Option Investigation - Norwood, MA(5/30/2008)-Analog Devices, Inc.

Cypress Unveils Online Solutions Library To Facilitate Faster, More Efficient PSoC® Designs - Free IP Resource at www.cypress.com/go/pr/solutions Enables Designers to Easily Recreate A Wide Range of Applications and Functions Using Flexible PSoC Architecture SAN JOSE, Calif., May 7, 2008 - Cypress Semiconductor Corp.

Cypress EZ-Color™ Solution Adds ColorLock™ Optical Feedback Support To Help LED Designers Maintain Perfect Color - Solution also Adds More Tools to Support White Lighting, Bringing Code-Free Design to a Broader Range of Applications SAN JOSE Calif., April 28, 2008 - Cypress Semiconductor Corp.

Cypress’s PSoC® CapSense Enables Touch-Sensitive Media Console In New Acer Aspire 6920 And 8920G Notebook PCs - Single-Chip Solution Lets Users Manage Entertainment Media, Navigate Menus,Adjust Volume and Control Media; Also Provides LED Control SAN JOSE, Calif., April 23, 2008 - Cypress Semiconductor Corp.

Cypress PSoC® CapSense™ Interface Selected To Implement Touch-Sensitive Controls On JVC's Super-Slim Everio Hard Disk Camcorders - Flexible Solution also Controls LEDs and Manages SPI Interface SAN JOSE, Calif., April 2, 2008 - Cypress Semiconductor Corp.

Ericsson finalizes reverse split 1:5 - Telefonaktiebolaget LM Ericsson's (NASDAQ: ERIC) Annual General Meeting on April 9, 2008 resolved on a reverse split 1:5 of the company's shares.

Tyco Electronics Expands TETRA Product Portfolio; Announces Partnership With Sepura - TETRA World Congress, Hong Kong - May 26, 2008 - Tyco Electronics announced today that its Wireless Network Solutions business, a worldwide leader of critical radio communications solutions, has signed a partnership agreement with Sepura, a major supplier of network-independent Terrestrial Trunked...

New PSoC® Textbook Addresses The Basics Of Mixed-Signal Embedded Design - "Introduction to Mixed-Signal, Embedded Design" Available at cypress.com/buyonline SAN JOSE, Calif., March 28, 2008 - "Introduction to Mixed-Signal, Embedded Design," a new textbook written by Dr. Alex N. Doboli and Dr. Edward H. Currie is now available.

Semtech Selects Prutton to Lead Power Management Group; Wilson Assumes Position Of Chief Technology Officer - Camarillo, California - May 29, 2008 Semtech Corp. (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced changes to its executive staff.

Altera’s Nios II Embedded Evaluation Kit Garners Tech Choice Awards - Nios II Evaluation Kit Receives Editor’s Choice and Reader’s Choice Awards for its FPGA Design Capabilities San Jose, Calif.

Patent Office Approves O2Micro's Power Conservation Methodology - O2Micro was issued 5 claims under United States patent number 7,340,621 for its Power Conservation Techniques for a digital computer.

Infineon Technologies revises outlook for Communications Solutions - Neubiberg, Germany – May 29, 2008 – Infineon Technologies today revised the outlook for its Communication Solutions segment due to lower volumes in certain wireless platform projects.

Lattice Semiconductor Appoints Interim CEO - HILLSBORO, OR - MAY 29, 2008 - Lattice Semiconductor Corporation (NASDAQ:LSCC) announced that its board of directors (the “Board”) has appointed Senior Vice President and Chief Financial Officer Jan Johannessen, 52, to serve as Interim President and Chief Executive Officer, effective...

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Toshiba develops cost competitive MEMS packaging technologies

Toshiba develops cost competitive MEMS packaging technologies

--Achieving world’s thinnest multi-chip MEMS package with control IC-- TOKYO--Toshiba Corporation today announced two optimized packaging technologies for micro electro-mechanical systems (MEMS) semiconductor packages that achieve significant cost reductions. [Read more...]

 

IPC holds July symposium on electronics and the environment

16.05.2008 08:30 - Source: Lead-Free Zone Blog

The Association Connecting Electronics Industries (IPC) will hold a Symposium on Electronics and the Environment in Cambridge, Mass. on July 16 – 17. Speakers include a mix of experts from OEMs, EMS companies, PCB manufacturers, industry suppliers, academia and government officials.

A focus on halogen free

Speakers will discuss what major OEMs are doing to eliminate brominated flame retardants, PCVs and other halogen containing materials from their products. IPC notes that the halogen-free movement will have a monumental effect on the materials, processes and products provided by the supply chain. In this follow-up to the January Intel/IPC Halogen-Free Symposium, OEMs and members of the supply chain will outline their efforts, goals and technological challenges in developing halogen-free electronics.

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