Electronic Engineering News Digest Electronic Engineering News Digest
Electronic Engineering News COMPONENT NEWS | INDUSTRY NEWS | RoHS/WEEE NEWS |   
Latest News

Douglas L. Gilstrap appointed Head of Ericsson Strategy - Douglas L. Gilstrap has been appointed Senior Vice President and Head of Group Function Strategy at Ericsson (NASDAQ: ERIC), effective as of October 1, 2009. Gilstrap brings to Ericsson more than 15 years experience in the global telecommunications and IT industry.

Fairchild Semiconductor Receives Hisense Strategic Supplier Award - Fairchild's extensive product portfolio targeting TVs plus superior technical and delivery support services recognized by leading TV manufacturer in China

Microchip Technology to Present at the Pacific Crest Securities 11th Annual Technology Forum - INVESTOR RELATIONS CONTACT: Deborah Wussler ……… (480) 792-7373 MICROCHIP TECHNOLOGY TO PRESENT AT THE PACIFIC CREST SECURITIES 11TH ANNUAL TECHNOLOGY FORUM CHANDLER, Arizona – August 10, 2009 -- (NASDAQ:MCHP) – Microchip Technology Incorporated, a leading provider of...

Microchip Technology to Present at the Morgan Keegan 2009 Summer in the City Technology Conference - INVESTOR RELATIONS CONTACT: Deborah Wussler ……… (480) 792-7373 MICROCHIP TECHNOLOGY TO PRESENT AT THE MORGAN KEEGAN 2009 SUMMER IN THE CITY TECHNOLOGY CONFERENCE CHANDLER, Arizona – August 10, 2009 -- (NASDAQ:MCHP) – Microchip Technology Incorporated, a leading...

Fairchild Semiconductor to Speak at Two Key Financial Conferences - Fairchild Semiconductor (NYSE: FCS), the leading global supplier of high performance products that optimize system power, today announced that Dan Janson, vice president, Investor Relations, will present at the Canaccord Adams' 29th Annual Global Growth Conference in Boston, MA on Wednesday, Aug. 12 at 10:30am ET.

Microchip Technology Exceeds Financial Guidance for the First Fiscal Quarter 2010 and Guides for Strong Growth for Second Quarter 2010 - MICROCHIP TECHNOLOGY EXCEEDS FINANCIAL GUIDANCE FOR THE FIRST FISCAL QUARTER 2010 AND GUIDES FOR STRONG GROWTH FOR SECOND FISCAL QUARTER 2010 Net sales of $192.9 million, up 11.4% sequentially On a GAAP basis: Gross margin of 50.0%; Operating profit of 16.2%; Net income of $27.

Microchip Technology Declares Quarterly Cash Dividend/Maintains Dividend Level at 33.9 Cents Per Share - MICROCHIP TECHNOLOGY DECLARES QUARTERLY CASH DIVIDEND; MAINTAINS DIVIDEND LEVEL OF 33.

Infineon expects capital increase to be fully placed - Neubiberg, Germany – August 4, 2009 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announces that a fund managed by Apollo Global Management LLC will subscribe for the approximately 14 million shares from the capital increase, which are still available as a result of unexercised subscription...

Macroblock Inc. Announces Half-Year Results of 2009 at Investor Conference on August 05, 2009 - 20009/08/05 Hsinchu, Taiwan—Macroblock, a leading manufacturer of LED driver, today released its half-year results of 2009, assessed the business environment, and outlined the business strategy at the investor conference on August 05, 2009.

Dynex Retains Bryan Mills Iradesso Corp - Lincoln, England, July 30, 2009 – Dynex Power Inc., a leading specialist high power semiconductor company, today announced that it has retained the services of Bryan Mills Iradesso Corp. (“BMIR”) to provide investor relations services.

Preliminary percentage of subscription rights exercised in Infineon’s capital increase is 96.7 percent - Neubiberg, Germany – August 3, 2009 – Infineon Technologies AG reports the preliminary percentage of subscription rights exercised in the announced capital increase.

Tony Sabetti Joins ID Team at NXP - Industry expert leads US sales team

International Rectifier Reaches Agreement in Principle to Settle Securities Class Action Lawsuit - EL SEGUNDO, Calif.--(BUSINESS WIRE)--Jul.

SST Reports Second Quarter 2009 Financial Results - News Release For More Information Contact: Leslie Green Green Communications Consulting, LLC (650) 312-9060 SUNNYVALE, Calif., July 28, 2009 -- SST (Silicon Storage Technology, Inc.

MAXWELL TECHNOLOGIES’ Q2 FINANCIAL RESULTS PRESS RELEASE, CONFERENCE CALL AND WEBCAST SET FOR AUGUST 6 - San Diego, CA — Maxwell Technologies, Inc. (Nasdaq: MXWL) will issue its financial results news release for the second quarter ended June 30, 2009, at 4 p.m. (EDT) on August 6, 2009.

News ArchiveElectronic News Digest RSS Feed
Add to My Yahoo! Add to Google Add to del.icio.us Add to Blinklist Add to Shadows
Sharp and Sony Enter into Definitive Agreement regarding Joint Venture to Produce and Sell Large-Sized LCD Panels and Modules

Sharp and Sony Enter into Definitive Agreement regarding Joint Venture to Produce and Sell Large-Sized LCD Panels and Modules

Sharp Corporation (“Sharp”) and Sony Corporation (“Sony”) today entered into an agreement (the “Joint Venture Agreement”) to establish a joint venture company to produce and sell large-sized LCD panels and modules. [Read more...]

 

Lenovo Names Spansion Best Supplier for 2007

18.12.2007 11:30 - Source: Spansion

Spansion Receives Honor from Lenovo for Fourth Consecutive Year

BEIJING, Dec 18, 2007 /PRNewswire-FirstCall via COMTEX News Network/ -- Spansion Inc. (Nasdaq: SPSN), the world's largest pure-play provider of Flash memory solutions, today announced that it has received the Best Supplier award from Lenovo Mobile Communication Technology Ltd. for 2007 for the fourth consecutive year. Spansion was the only NOR Flash memory supplier selected.

(Logo: http://www.newscom.com/cgi-bin/prnh/20060118/SFW077LOGO)

The award, Lenovo's highest form of recognition for its suppliers, represents an important customer acknowledgement of Spansion's commitment to providing advanced Flash memory solutions and customer support to the Chinese wireless handset industry. It also demonstrates the strong recognition for Spansion's achievements in China, one of the key emerging markets in wireless industry.

"Spansion has continuously contributed to Lenovo's success as our principal Flash memory supplier," said Mr. ZhiJun Liu, senior vice president of Lenovo Group and general manager of Lenovo Mobile Communication Technology Ltd. "Spansion's outstanding customer service, innovative products and total systems solutions approach enables us to address the dynamic user demands and bring more exciting wireless experiences to our customers."

With the rapid pace of developments in today's wireless industry, mobile users are increasingly demanding advanced multi-media features in handsets, which creates a growing challenge for handset designers to develop platforms that accommodate flexible amounts of both code and data storage. Targeting this trend, memory sub-systems based on Spansion's proprietary MirrorBit(R) technology enable a range of storage capabilities, as well as help handset OEMs reduce time-to-market and design complexity. Furthermore, Spansion's latest revolutionary MirrorBit Eclipse(TM) architecture is designed to enable higher performance feature phones to efficiently support the increasing number of multimedia applications while reducing the handset power consumption and OEM BOM costs significantly.

"Winning Lenovo's Best Supplier of The Year for the fourth consecutive year is a strong endorsement of Spansion's high-quality solutions and outstanding service. It also demonstrates that Lenovo Mobile has strong confidence in future business growth opportunities with Spansion," said Gary Wang, corporate vice president and president of Spansion Asia. "By leveraging the cost-efficiency and density flexibility of Spansion's MirrorBit technology, Lenovo can offer innovative handset products for a range of platforms and user expectations. Spansion will continue to work closely with Lenovo to deliver memory solutions with high performance, more advanced storage features and capacity."

Lenovo's Best Supplier award is given to the industry's leading companies who have contributed to the success of the company with cutting-edge, high-quality, but cost-effective products and solutions, as well as strong customer support and stable product supplying.

Spansion in China

Spansion designs, manufacturers and supplies Flash memory solutions in greater China, working with the top consumer electronics OEMs and wireless handset manufacturers in the region. Spansion has over 1,300 employees located in China with a final manufacturing facility in Suzhou, design centers in Suzhou and Beijing and sales and marketing offices in Beijing, Shanghai, Shenzhen and Taipei.

About Lenovo Mobile Communication Technology Ltd.

Lenovo Mobile Communication Technology Ltd. is a joint venture founded by Lenovo Group and Xiamen Overseas Chinese Electronics Co., Ltd. in April 2002 with an investment of 187.5 million RMB. It later became a wholly owned subsidiary of Lenovo Group. Lenovo Mobile focuses on the R&D, manufacturing, sales and service for Lenovo mobile phones. With a staff of over 2,000 professionals and a variety of business units, including R&D, product and marketing, Lenovo Mobile Communication Technology offers strong R&D capability in communication technology and core technology for mobile phone development by partnering with major enterprises in the world. For more information, please visit http://www.lenovomobile.com.

About Spansion

Spansion is a leading Flash memory solutions provider, dedicated to enabling, storing and protecting digital content in the wireless, automotive, networking and consumer electronics applications. Spansion, previously a joint venture of AMD and Fujitsu, is the largest company in the world dedicated exclusively to designing, developing, manufacturing, marketing and selling Flash memory solutions. For more information, visit http://www.spansion.com.

Spansion(R), the Spansion logo, MirrorBit(R), MirrorBit(R) Eclipse(TM), ORNAND(TM), ORNAND 2(TM), HD-SIM(TM) and combinations thereof, are trademarks of Spansion LLC in the U.S. and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.

Original text is here