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Macroblock Inc. Announces 1st Quarter Results of 2009 at Investor Conference Held by GTSM on April 29, 2009 - Hsinchu, Taiwan—Macroblock, a leading manufacturer of LED driver, today released its annual results of fiscal year 2008 and the first quarter results of 2009. The gross profit margin in the first quarter of 2009 outperformed that of the same period of last year.

SST Reports First Quarter 2009 Financial Results - News Release For More Information Contact: Leslie Green Green Communications Consulting, LLC (650) 312-9060 SUNNYVALE, Calif., April 28, 2009 -- SST (Silicon Storage Technology, Inc.

Dynex Announces Advance Payment from CSR Times Electric - Lincoln, England, February 6th, 2009 – Dynex Power Inc., a leading specialist high power semiconductor company, today announced that its UK subsidiary, Dynex Semiconductor Ltd., has agreed new distributor arrangements with CSR Times Electric.

Green Packet and GCT Semiconductor Join Forces to Develop World's First Automated Wireless Roaming Solution - Green Packet and GCT Semiconductor Join Forces to Develop World's First Automated Wireless Roaming Solution Business Wire -- April 28, 2009 GCT's Single-Chip Dual-Mode Solution Combined With Green Packet's Connection Manager Software Designed to Offer a Truly Seamless WiFi to WiMAX User Experience...

UMC Board of Directors Important Announcement - Taipei, Taiwan, R.O.C. - April 29, 2009 - United Microelectronics Corporation (NYSE: UMC, TSE: 2303), ("UMC") convened its 19th session, 10th term of its Board of Directors meeting today.

UMC, Springsoft Support Custom Chip Design with 65nm Process Design Kit - Companies deliver foundry-certified Laker-UMC PDK to streamline implementation and manufacturing of leading-edge IC designs Hsinchu, Taiwan, April 27, 2009 -UMC (NYSE: UMC; TSE: 2303), a leading global semiconductor foundry, and SpringSoft, Inc.

UMC Recognized for Excellence by Texas Instruments - HSINCHU, Taiwan, April 27, 2009 -UMC (NYSE: UMC; TWSE: 2303), a leading global semiconductor foundry, announced that the company was formally presented with a Texas Instruments (TI) 2008 Supplier Excellence Award during a special ceremony held today between executives from TI and UMC.

AMD Joins Microsoft® System Center Alliance - — Development continues on DASH plug-in for Microsoft System Center Configuration Manager to enable secure, remote out-of-band management for business PCs — Microsoft Management Summit, LAS VEGAS -- April 28, 2009 --Today AMD (NYSE: AMD) announced its membership in the Microsoft System Center...

MoSys, Inc. Reports First Quarter 2009 Financial Results - | RSS Feeds | E-mail Alerts | View...

Spansion Garners Highest Score of All Semiconductor Suppliers, Receives Top Honor From Stack International - SUNNYVALE, Calif., April 27, 2009 /PRNewswire-FirstCall via COMTEX News Network/ -- Spansion Inc.

ZTE Partners with Semtech on IEEE1588v2 Products for WiMax Basestations, IP Backhaul and Femtocells - ACS95xx ToPSync™ Platform Enables IP Backhaul in Building Femtocells and Other TDM-IP Synchronization Applications Camarillo, California - April 27, 2009 Semtech Corp. (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced that ZTE Corp.

Ericsson and MobiCom bring mobile broadband to Mongolia - Mongolian operator MobiCom has launched the first high-speed mobile broadband network in the country, powered by HSPA technology from Ericsson (NASDAQ:ERIC).

13 Apr 2009 - Freescale Semiconductor Schedules First Quarter 2009 Results Conference Call - AUSTIN, Texas - April 13, 2009 - Freescale Semiconductor will announce its first quarter financial results in a press release at 3:00 p.m. CDT, Wednesday, April 22, 2009. The press release will be posted at www.freescale.com/investor.

Analog Devices and Infineon to Collaborate on Next-Generation Automotive Airbag Safety System - Norwood, Mass., USA and Neubiberg, Germany – April 27, 2009 – Analog Devices, Inc.

Executive Appointment - ...

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Microchip Launches Capacitive Touch Eval Kit

Microchip Launches Capacitive Touch Eval Kit

Editorial Contact: Reader/Literature Inquiries: Michelle Ragsdale 1-888-MCU-MCHP 480-792-4111 http://www.microchip.com/mtouch michelle. [Read more...]

 

Semtech’s Space Saving Filter Devices Protect High-Resolution LCD Screens on 3G Phones

18.12.2008 09:30 - Source: Semtech Corporation

EClamp237xK family joins Semtech protection platform offering high attenuation for lines operating up to 2.5 GHz

Camarillo, California - December 18, 2008

Semtech Corp. (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced the EClamp™237xK family of resistor-capacitor (R-C) protection devices with the low capacitance, high attenuation and low clamping voltage needed for high-resolution color LCD interfaces in GSM and CDMA-based 3G handsets. 

EClamp237xKThe devices expand Semtech’s EMIClampTM protection products portfolio by safeguarding lines from cellular frequencies between 1.8 GHz to 2.5 GHz – the data rates required by the latest generation of high-resolution LCD screens used for visually oriented 3G handsets.  The EClamp237xK series includes the four-line EClamp2374K, the six-line EClamp2376K and the eight-line EClamp2378K. These EClamp237xK devices have a very low C(in) value of 20pF, and together with a series resistance of 100, they provide greater than 30dB attenuation for cell phone frequencies.

The EClamp237xK packages are narrow (1.3 mm) and low profile (0.50mm) with a variable length depending on the number of lines supported. The flow-through design of the devices simplifies signal routing for a faster and more convenient layout.  These parts feature a 400-micron lead pitch saving up to 33 percent in board space compared to 500 micron pitch parts, and with a height reduction of 14 percent, they enable filter protection in low-profile designs.

Each device in the family includes TVS diodes for electrostatic discharge (ESD) protection and an R-C network for electromagnetic interference (EMI) and radio frequency interference (RFI) filtering.  The devices complement Semtech’s EClamp238xK series of resistor-capacitor (R-C) devices, giving designers more flexibility for protecting color LCD displays.

The EClamp237xK devices are available in the RoHS/WEEE-compliant Semtech Leadless Package (SLP), which offers the same small, low-profile design as “flip chip” alternatives, but with increased manufacturing durability. The high integration of the EClamp237xK devices replaces 32 discrete passive devices in a typical handset design, thus saving board space.

“While higher-resolution screens on handsets are enabling a wide range of new consumer services, they still remain a high EMI/ESD threat environment,” said Rick Hansen, Semtech's Director of Marketing for Protection Products. “This new product family gives manufacturers both the higher data rates they need for these LCDs as well as the low profile and small size that provides a lot of design flexibility for smaller handset form factors.”

While these products offer designers the benefit of significant board space savings, their small size and RoHS & WEEE compliance also contributes to energy conservation and hazardous waste reduction.

Key Features of the EClamp237xK

Pricing and Availability

The EClamp2374K (order code: EClamp2374K.TCT) is priced at $0.25 each in 1,000-piece lots; the EClamp2376K (order code: EClamp2376K.TCT) is priced at $0.33 each in 1,000-piece lots; and the EClamp2378K (order code: EClamp2378K.TCT) is priced at $0.40 each in 1,000-piece lots.  All three parts are available immediately in production quantities.   Semtech offers comprehensive design assistance, including field- and factory-based support. Data sheets, volume pricing, and delivery quotes, as well as evaluation kits and samples, are available by contacting info@semtech.com.

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