Electronic Engineering News Digest Electronic Engineering News Digest
Electronic Engineering News COMPONENT NEWS | INDUSTRY NEWS | RoHS/WEEE NEWS |   
Latest News

Macroblock Inc. Announces 1st Quarter Results of 2009 at Investor Conference Held by GTSM on April 29, 2009 - Hsinchu, Taiwan—Macroblock, a leading manufacturer of LED driver, today released its annual results of fiscal year 2008 and the first quarter results of 2009. The gross profit margin in the first quarter of 2009 outperformed that of the same period of last year.

SST Reports First Quarter 2009 Financial Results - News Release For More Information Contact: Leslie Green Green Communications Consulting, LLC (650) 312-9060 SUNNYVALE, Calif., April 28, 2009 -- SST (Silicon Storage Technology, Inc.

Dynex Announces Advance Payment from CSR Times Electric - Lincoln, England, February 6th, 2009 – Dynex Power Inc., a leading specialist high power semiconductor company, today announced that its UK subsidiary, Dynex Semiconductor Ltd., has agreed new distributor arrangements with CSR Times Electric.

Green Packet and GCT Semiconductor Join Forces to Develop World's First Automated Wireless Roaming Solution - Green Packet and GCT Semiconductor Join Forces to Develop World's First Automated Wireless Roaming Solution Business Wire -- April 28, 2009 GCT's Single-Chip Dual-Mode Solution Combined With Green Packet's Connection Manager Software Designed to Offer a Truly Seamless WiFi to WiMAX User Experience...

UMC Board of Directors Important Announcement - Taipei, Taiwan, R.O.C. - April 29, 2009 - United Microelectronics Corporation (NYSE: UMC, TSE: 2303), ("UMC") convened its 19th session, 10th term of its Board of Directors meeting today.

UMC, Springsoft Support Custom Chip Design with 65nm Process Design Kit - Companies deliver foundry-certified Laker-UMC PDK to streamline implementation and manufacturing of leading-edge IC designs Hsinchu, Taiwan, April 27, 2009 -UMC (NYSE: UMC; TSE: 2303), a leading global semiconductor foundry, and SpringSoft, Inc.

UMC Recognized for Excellence by Texas Instruments - HSINCHU, Taiwan, April 27, 2009 -UMC (NYSE: UMC; TWSE: 2303), a leading global semiconductor foundry, announced that the company was formally presented with a Texas Instruments (TI) 2008 Supplier Excellence Award during a special ceremony held today between executives from TI and UMC.

AMD Joins Microsoft® System Center Alliance - — Development continues on DASH plug-in for Microsoft System Center Configuration Manager to enable secure, remote out-of-band management for business PCs — Microsoft Management Summit, LAS VEGAS -- April 28, 2009 --Today AMD (NYSE: AMD) announced its membership in the Microsoft System Center...

MoSys, Inc. Reports First Quarter 2009 Financial Results - | RSS Feeds | E-mail Alerts | View...

Spansion Garners Highest Score of All Semiconductor Suppliers, Receives Top Honor From Stack International - SUNNYVALE, Calif., April 27, 2009 /PRNewswire-FirstCall via COMTEX News Network/ -- Spansion Inc.

ZTE Partners with Semtech on IEEE1588v2 Products for WiMax Basestations, IP Backhaul and Femtocells - ACS95xx ToPSync™ Platform Enables IP Backhaul in Building Femtocells and Other TDM-IP Synchronization Applications Camarillo, California - April 27, 2009 Semtech Corp. (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced that ZTE Corp.

Ericsson and MobiCom bring mobile broadband to Mongolia - Mongolian operator MobiCom has launched the first high-speed mobile broadband network in the country, powered by HSPA technology from Ericsson (NASDAQ:ERIC).

13 Apr 2009 - Freescale Semiconductor Schedules First Quarter 2009 Results Conference Call - AUSTIN, Texas - April 13, 2009 - Freescale Semiconductor will announce its first quarter financial results in a press release at 3:00 p.m. CDT, Wednesday, April 22, 2009. The press release will be posted at www.freescale.com/investor.

Analog Devices and Infineon to Collaborate on Next-Generation Automotive Airbag Safety System - Norwood, Mass., USA and Neubiberg, Germany – April 27, 2009 – Analog Devices, Inc.

Executive Appointment - ...

News ArchiveElectronic News Digest RSS Feed
Add to My Yahoo! Add to Google Add to del.icio.us Add to Blinklist Add to Shadows
Microchip Launches Capacitive Touch Eval Kit

Microchip Launches Capacitive Touch Eval Kit

Editorial Contact: Reader/Literature Inquiries: Michelle Ragsdale 1-888-MCU-MCHP 480-792-4111 http://www.microchip.com/mtouch michelle. [Read more...]

 

SiS Cheers Emerging Market by Launching Best-Value PC

15.03.2007 20:30 - Source: SiS Corp.

CeBIT 2007, Hannover, Germany, March 15th, 2007---SiS today proudly presented its complete “Best-Value PC” solutions at the SiS booth of CeBIT2007. By introducing the “Best-Value PC” solutions which are based on SiS chipsets, SiS hope to catch more attention from visitors at CeBIT 2007.

To satisfy the increasing demand for PC from the emerging market, many OEM and branding PC makers have dedicated their effort to this field. Due to the advancement in PC technologies, it doesn't cost much to build a high-performance PC system. As a professional PC chipset design house, SiS provides full support to all the PC and motherboard makers developing the low-cost PC solutions. And to bring more value to all the low-cost PC users, SiS works with its customers creating the “Best-Value PC” solutions.

Including the SiS741GX, SiSM661GX, and newly-developed SiS662 and SiS761GX chipsets, the SiS chipsets have been widely adopted by customers. For example, Intel has used SiSM661GX/964 and SiS662/964L as the chipset combination for their low-cost PC solutions; and the low-cost PCs from Fujitsu Siemens and HP based on SiS741CX/964 chipsets are on demo at the SiS booth.

The SiS661CX/963L and SiS661CX/966 chipsets can be found on the Panel PCs from RISE and IEI. Lite-On has adopted the SiSM661GX/964L and SiS741CX/964 on their low-cost PC solutions. All these products will be on display at the SiS booth.

With the 20-yrs experience in developing PC chipset, SiS has been working with customers introducing various “Best-Value PC” solutions emerging markets. By displaying all these Best-Value PC solutions at the booth, SiS has shown its enthusiasm on developing the low-cost PC solution.

Original text is here