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Macroblock Inc. Announces 1st Quarter Results of 2009 at Investor Conference Held by GTSM on April 29, 2009 - Hsinchu, Taiwan—Macroblock, a leading manufacturer of LED driver, today released its annual results of fiscal year 2008 and the first quarter results of 2009. The gross profit margin in the first quarter of 2009 outperformed that of the same period of last year.

SST Reports First Quarter 2009 Financial Results - News Release For More Information Contact: Leslie Green Green Communications Consulting, LLC (650) 312-9060 SUNNYVALE, Calif., April 28, 2009 -- SST (Silicon Storage Technology, Inc.

Dynex Announces Advance Payment from CSR Times Electric - Lincoln, England, February 6th, 2009 – Dynex Power Inc., a leading specialist high power semiconductor company, today announced that its UK subsidiary, Dynex Semiconductor Ltd., has agreed new distributor arrangements with CSR Times Electric.

Green Packet and GCT Semiconductor Join Forces to Develop World's First Automated Wireless Roaming Solution - Green Packet and GCT Semiconductor Join Forces to Develop World's First Automated Wireless Roaming Solution Business Wire -- April 28, 2009 GCT's Single-Chip Dual-Mode Solution Combined With Green Packet's Connection Manager Software Designed to Offer a Truly Seamless WiFi to WiMAX User Experience...

UMC Board of Directors Important Announcement - Taipei, Taiwan, R.O.C. - April 29, 2009 - United Microelectronics Corporation (NYSE: UMC, TSE: 2303), ("UMC") convened its 19th session, 10th term of its Board of Directors meeting today.

UMC, Springsoft Support Custom Chip Design with 65nm Process Design Kit - Companies deliver foundry-certified Laker-UMC PDK to streamline implementation and manufacturing of leading-edge IC designs Hsinchu, Taiwan, April 27, 2009 -UMC (NYSE: UMC; TSE: 2303), a leading global semiconductor foundry, and SpringSoft, Inc.

UMC Recognized for Excellence by Texas Instruments - HSINCHU, Taiwan, April 27, 2009 -UMC (NYSE: UMC; TWSE: 2303), a leading global semiconductor foundry, announced that the company was formally presented with a Texas Instruments (TI) 2008 Supplier Excellence Award during a special ceremony held today between executives from TI and UMC.

AMD Joins Microsoft® System Center Alliance - — Development continues on DASH plug-in for Microsoft System Center Configuration Manager to enable secure, remote out-of-band management for business PCs — Microsoft Management Summit, LAS VEGAS -- April 28, 2009 --Today AMD (NYSE: AMD) announced its membership in the Microsoft System Center...

MoSys, Inc. Reports First Quarter 2009 Financial Results - | RSS Feeds | E-mail Alerts | View...

Spansion Garners Highest Score of All Semiconductor Suppliers, Receives Top Honor From Stack International - SUNNYVALE, Calif., April 27, 2009 /PRNewswire-FirstCall via COMTEX News Network/ -- Spansion Inc.

ZTE Partners with Semtech on IEEE1588v2 Products for WiMax Basestations, IP Backhaul and Femtocells - ACS95xx ToPSync™ Platform Enables IP Backhaul in Building Femtocells and Other TDM-IP Synchronization Applications Camarillo, California - April 27, 2009 Semtech Corp. (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced that ZTE Corp.

Ericsson and MobiCom bring mobile broadband to Mongolia - Mongolian operator MobiCom has launched the first high-speed mobile broadband network in the country, powered by HSPA technology from Ericsson (NASDAQ:ERIC).

13 Apr 2009 - Freescale Semiconductor Schedules First Quarter 2009 Results Conference Call - AUSTIN, Texas - April 13, 2009 - Freescale Semiconductor will announce its first quarter financial results in a press release at 3:00 p.m. CDT, Wednesday, April 22, 2009. The press release will be posted at www.freescale.com/investor.

Analog Devices and Infineon to Collaborate on Next-Generation Automotive Airbag Safety System - Norwood, Mass., USA and Neubiberg, Germany – April 27, 2009 – Analog Devices, Inc.

Executive Appointment - ...

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Microchip Launches Capacitive Touch Eval Kit

Microchip Launches Capacitive Touch Eval Kit

Editorial Contact: Reader/Literature Inquiries: Michelle Ragsdale 1-888-MCU-MCHP 480-792-4111 http://www.microchip.com/mtouch michelle. [Read more...]

 

SiS Presents Full Line of Windows Vista Ready Chipsets to Grab Your Attention at CeBIT 2007

15.03.2007 20:30 - Source: SiS Corp.

CeBIT Hannover, Germany, March 15th, 2007---SiS, as a pioneering chipset innovator, announced today that it will unveil the most advanced chipsets supporting Windows Vista™ at CeBIT 2007.

The SiS672FX series, SiS671FX series, and SiS771 series chipsets are SiS special innovations. They are designed for optimum compatibility with Windows Vista™, and support mobile PCs and desktop PCs platforms. All of these chipsets have received certification from Microsoft. At CeBIT this year, SiS will introduce its full product line of chipsets for powering Windows Vista™. For Intel platform, SiS presents SiS672FX, SiS672, SiSM672MX, SiS671FX, SiS671, SiS671DX, and SiSM671MX chipsets; for AMD platform, SiS unveils the SiS771 chipset. Visitors can personally experience the impressive and excellent performance of systems provided by SiS chipsets at the world's largest IT trade fair. With SiS high-end Mirage™3+ graphics engine, high quality digital entertainment experiences can be explored thoroughly. Customers will be able to enjoy TV shows, movies, photos, games, and more on either Intel or AMD platforms.

In order to present the high performance systems that adopt the latest SiS Windows Vista™ ready chipsets, this year, SiS set up a flagship section to live demo its star products. Furthermore, NB live-demo section and static motherboard section will also be highlighted in this exhibition.

In the live-demo section, the SiS672FX/SiS968, SiS672/SiS968, and SiSM672MX/SiS968 chipsets for Intel platforms will be on display; also, the SiS771/SiS968 chipsets for AMD platform will be presented. All of the platforms will be running Windows Vista™. With SiS Mirage™3+ graphics engine, the SiS672FX, SiS672, SiSM672MX, and SiS771 chipsets support DirectX9. Also, the Mirage™3+ graphics engine is integrated with Pixel Shader 2.0, Texture Pipelines, Texture Filtering and Cubic Mapping Technologies to enhance the performance of the 2D and 3D graphics. Combining with the equipped media player and SiS Real Video technology, the video quality can be performed perfectly whenever you are watching TV shows, VCD, DVD, or pictures. In addition, SiS chipsets enhance the security and reliability of the systems when users are surfing the internet, emailing, using instant messenger, and editing documents using Windows Vista™.

In the Mobile platform live-demo section, SiS also focuses on customers' NB PCs which adopt SiS' latest Windows Vista ready chipsets. The SiS671DX/SiS968 chipsets are adopted by in Asus F5V; the SiSM671MX/SiS968 chipsets are adopted by Clevo M720S.

In static motherboard section, SiS showcased full range of motherboards aiming to fulfill different customers' requirements. On display are SiS672FX-based motherboards from Asrock, ECS, Foxconn, Gigabyte, MSI, and USI. There is one SiS672-based motherboard from Asus, and the SiS671FX-based motherboards from Asus, ECS, Foxconn, Gigabyte, MSI, PC Partner, PCchips, and USI, will also be displayed. The SiS671-based motherboards from Axper and MSI and the SiS671DX-based motherboard from Gigabyte will be presented in static MB display section. All of the above-mentioned motherboards are compatible with Windows Vista™ which enable a more efficient search engine for more secure web surfing, better graphics performance, and higher integrated media functions.

The release of Windows Vista™ pushes forward the development of the PC industry. Such a breakthrough results in the rapid changes of computer hardware, which mostly refers to desktop PCs, notebook PCs, and motherboards. SiS, with 20 years' experience in developing PC chipsets, will present its achievements to visitors from all over the world. In the meantime, SiS will enable visitors to enter a new era of Windows Vista™.

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