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Macroblock Inc. Announces 1st Quarter Results of 2009 at Investor Conference Held by GTSM on April 29, 2009 - Hsinchu, Taiwan—Macroblock, a leading manufacturer of LED driver, today released its annual results of fiscal year 2008 and the first quarter results of 2009. The gross profit margin in the first quarter of 2009 outperformed that of the same period of last year.

SST Reports First Quarter 2009 Financial Results - News Release For More Information Contact: Leslie Green Green Communications Consulting, LLC (650) 312-9060 SUNNYVALE, Calif., April 28, 2009 -- SST (Silicon Storage Technology, Inc.

Dynex Announces Advance Payment from CSR Times Electric - Lincoln, England, February 6th, 2009 – Dynex Power Inc., a leading specialist high power semiconductor company, today announced that its UK subsidiary, Dynex Semiconductor Ltd., has agreed new distributor arrangements with CSR Times Electric.

Green Packet and GCT Semiconductor Join Forces to Develop World's First Automated Wireless Roaming Solution - Green Packet and GCT Semiconductor Join Forces to Develop World's First Automated Wireless Roaming Solution Business Wire -- April 28, 2009 GCT's Single-Chip Dual-Mode Solution Combined With Green Packet's Connection Manager Software Designed to Offer a Truly Seamless WiFi to WiMAX User Experience...

UMC Board of Directors Important Announcement - Taipei, Taiwan, R.O.C. - April 29, 2009 - United Microelectronics Corporation (NYSE: UMC, TSE: 2303), ("UMC") convened its 19th session, 10th term of its Board of Directors meeting today.

UMC, Springsoft Support Custom Chip Design with 65nm Process Design Kit - Companies deliver foundry-certified Laker-UMC PDK to streamline implementation and manufacturing of leading-edge IC designs Hsinchu, Taiwan, April 27, 2009 -UMC (NYSE: UMC; TSE: 2303), a leading global semiconductor foundry, and SpringSoft, Inc.

UMC Recognized for Excellence by Texas Instruments - HSINCHU, Taiwan, April 27, 2009 -UMC (NYSE: UMC; TWSE: 2303), a leading global semiconductor foundry, announced that the company was formally presented with a Texas Instruments (TI) 2008 Supplier Excellence Award during a special ceremony held today between executives from TI and UMC.

AMD Joins Microsoft® System Center Alliance - — Development continues on DASH plug-in for Microsoft System Center Configuration Manager to enable secure, remote out-of-band management for business PCs — Microsoft Management Summit, LAS VEGAS -- April 28, 2009 --Today AMD (NYSE: AMD) announced its membership in the Microsoft System Center...

MoSys, Inc. Reports First Quarter 2009 Financial Results - | RSS Feeds | E-mail Alerts | View...

Spansion Garners Highest Score of All Semiconductor Suppliers, Receives Top Honor From Stack International - SUNNYVALE, Calif., April 27, 2009 /PRNewswire-FirstCall via COMTEX News Network/ -- Spansion Inc.

ZTE Partners with Semtech on IEEE1588v2 Products for WiMax Basestations, IP Backhaul and Femtocells - ACS95xx ToPSync™ Platform Enables IP Backhaul in Building Femtocells and Other TDM-IP Synchronization Applications Camarillo, California - April 27, 2009 Semtech Corp. (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced that ZTE Corp.

Ericsson and MobiCom bring mobile broadband to Mongolia - Mongolian operator MobiCom has launched the first high-speed mobile broadband network in the country, powered by HSPA technology from Ericsson (NASDAQ:ERIC).

13 Apr 2009 - Freescale Semiconductor Schedules First Quarter 2009 Results Conference Call - AUSTIN, Texas - April 13, 2009 - Freescale Semiconductor will announce its first quarter financial results in a press release at 3:00 p.m. CDT, Wednesday, April 22, 2009. The press release will be posted at www.freescale.com/investor.

Analog Devices and Infineon to Collaborate on Next-Generation Automotive Airbag Safety System - Norwood, Mass., USA and Neubiberg, Germany – April 27, 2009 – Analog Devices, Inc.

Executive Appointment - ...

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Microchip Launches Capacitive Touch Eval Kit

Microchip Launches Capacitive Touch Eval Kit

Editorial Contact: Reader/Literature Inquiries: Michelle Ragsdale 1-888-MCU-MCHP 480-792-4111 http://www.microchip.com/mtouch michelle. [Read more...]

 

Spansion Statement on ITC Institutes Investigation on Certain Flash Memory Chips and Products

19.12.2008 11:30 - Source: Spansion

SUNNYVALE, Calif., Dec 18, 2008 /PRNewswire-FirstCall via COMTEX News Network/ --

The International Trade Commission (ITC) issued its decision to institute an investigation on certain Flash memory chips and products based on a complaint filed by Spansion Inc. on November 17, 2008.

(Logo: http://www.newscom.com/cgi-bin/prnh/20060118/SFW077LOGO)

This decree is commensurate with the outcome Spansion expected in this case. Spansion is committed to complying fully with the ITC and hopes to resolve any outstanding issues as quickly as possible in the interest of consumers and the industry.

By instituting this investigation, the ITC has not yet made any decision on the merits of the case. The ITC's Chief Administrative Law Judge will assign the case to one of the ITC's six Administrative Law Judges (ALJ), who will schedule and hold an evidentiary hearing. The ALJ will make an initial determination as to whether there is a violation and that initial determination is subject to review by the Commission.

Note to editors: If you are interested in viewing any of the ITC filings, please visit the Spansion web page at http://www.spansion.com/about/ipinfringement_press_kit_cd.html.

About Spansion

Spansion (Nasdaq: SPSN -- News) is a leading Flash memory solutions provider, dedicated to enabling, storing and protecting digital content in wireless, automotive, networking and consumer electronics applications. Spansion, previously a joint venture of AMD and Fujitsu, is the largest company in the world dedicated exclusively to designing, developing, manufacturing, marketing, selling and licensing Flash memory solutions. For more information, visit http://www.spansion.com.

Spansion(R), the Spansion logo, MirrorBit(R), MirrorBit(R) Eclipse(TM), ORNAND(TM), ORNAND2(TM), HD-SIM(TM), Spansion(R) EcoRAM(TM) and combinations thereof, are trademarks of Spansion LLC in the U.S. and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.

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