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Douglas L. Gilstrap appointed Head of Ericsson Strategy - Douglas L. Gilstrap has been appointed Senior Vice President and Head of Group Function Strategy at Ericsson (NASDAQ: ERIC), effective as of October 1, 2009. Gilstrap brings to Ericsson more than 15 years experience in the global telecommunications and IT industry.

Fairchild Semiconductor Receives Hisense Strategic Supplier Award - Fairchild's extensive product portfolio targeting TVs plus superior technical and delivery support services recognized by leading TV manufacturer in China

Microchip Technology to Present at the Pacific Crest Securities 11th Annual Technology Forum - INVESTOR RELATIONS CONTACT: Deborah Wussler ……… (480) 792-7373 MICROCHIP TECHNOLOGY TO PRESENT AT THE PACIFIC CREST SECURITIES 11TH ANNUAL TECHNOLOGY FORUM CHANDLER, Arizona – August 10, 2009 -- (NASDAQ:MCHP) – Microchip Technology Incorporated, a leading provider of...

Microchip Technology to Present at the Morgan Keegan 2009 Summer in the City Technology Conference - INVESTOR RELATIONS CONTACT: Deborah Wussler ……… (480) 792-7373 MICROCHIP TECHNOLOGY TO PRESENT AT THE MORGAN KEEGAN 2009 SUMMER IN THE CITY TECHNOLOGY CONFERENCE CHANDLER, Arizona – August 10, 2009 -- (NASDAQ:MCHP) – Microchip Technology Incorporated, a leading...

Fairchild Semiconductor to Speak at Two Key Financial Conferences - Fairchild Semiconductor (NYSE: FCS), the leading global supplier of high performance products that optimize system power, today announced that Dan Janson, vice president, Investor Relations, will present at the Canaccord Adams' 29th Annual Global Growth Conference in Boston, MA on Wednesday, Aug. 12 at 10:30am ET.

Microchip Technology Exceeds Financial Guidance for the First Fiscal Quarter 2010 and Guides for Strong Growth for Second Quarter 2010 - MICROCHIP TECHNOLOGY EXCEEDS FINANCIAL GUIDANCE FOR THE FIRST FISCAL QUARTER 2010 AND GUIDES FOR STRONG GROWTH FOR SECOND FISCAL QUARTER 2010 Net sales of $192.9 million, up 11.4% sequentially On a GAAP basis: Gross margin of 50.0%; Operating profit of 16.2%; Net income of $27.

Microchip Technology Declares Quarterly Cash Dividend/Maintains Dividend Level at 33.9 Cents Per Share - MICROCHIP TECHNOLOGY DECLARES QUARTERLY CASH DIVIDEND; MAINTAINS DIVIDEND LEVEL OF 33.

Infineon expects capital increase to be fully placed - Neubiberg, Germany – August 4, 2009 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announces that a fund managed by Apollo Global Management LLC will subscribe for the approximately 14 million shares from the capital increase, which are still available as a result of unexercised subscription...

Macroblock Inc. Announces Half-Year Results of 2009 at Investor Conference on August 05, 2009 - 20009/08/05 Hsinchu, Taiwan—Macroblock, a leading manufacturer of LED driver, today released its half-year results of 2009, assessed the business environment, and outlined the business strategy at the investor conference on August 05, 2009.

Dynex Retains Bryan Mills Iradesso Corp - Lincoln, England, July 30, 2009 – Dynex Power Inc., a leading specialist high power semiconductor company, today announced that it has retained the services of Bryan Mills Iradesso Corp. (“BMIR”) to provide investor relations services.

Preliminary percentage of subscription rights exercised in Infineon’s capital increase is 96.7 percent - Neubiberg, Germany – August 3, 2009 – Infineon Technologies AG reports the preliminary percentage of subscription rights exercised in the announced capital increase.

Tony Sabetti Joins ID Team at NXP - Industry expert leads US sales team

International Rectifier Reaches Agreement in Principle to Settle Securities Class Action Lawsuit - EL SEGUNDO, Calif.--(BUSINESS WIRE)--Jul.

SST Reports Second Quarter 2009 Financial Results - News Release For More Information Contact: Leslie Green Green Communications Consulting, LLC (650) 312-9060 SUNNYVALE, Calif., July 28, 2009 -- SST (Silicon Storage Technology, Inc.

MAXWELL TECHNOLOGIES’ Q2 FINANCIAL RESULTS PRESS RELEASE, CONFERENCE CALL AND WEBCAST SET FOR AUGUST 6 - San Diego, CA — Maxwell Technologies, Inc. (Nasdaq: MXWL) will issue its financial results news release for the second quarter ended June 30, 2009, at 4 p.m. (EDT) on August 6, 2009.

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Sharp and Sony Enter into Definitive Agreement regarding Joint Venture to Produce and Sell Large-Sized LCD Panels and Modules

Sharp and Sony Enter into Definitive Agreement regarding Joint Venture to Produce and Sell Large-Sized LCD Panels and Modules

Sharp Corporation (“Sharp”) and Sony Corporation (“Sony”) today entered into an agreement (the “Joint Venture Agreement”) to establish a joint venture company to produce and sell large-sized LCD panels and modules. [Read more...]

 

UMC, Springsoft Support Custom Chip Design with 65nm Process Design Kit

29.04.2009 05:30 - Source: UMC

Companies deliver foundry-certified Laker-UMC PDK to streamline implementation and manufacturing of leading-edge IC designs

Hsinchu, Taiwan, April 27, 2009 -UMC (NYSE: UMC; TSE: 2303), a leading global semiconductor foundry, and SpringSoft, Inc. (TAIEX: 2473), a global supplier of specialized IC design software, today announced immediate availability of the foundry-certified Laker™ process design kit (PDK) for UMC 65-nanometer (nm) manufacturing technologies. This jointly developed PDK is the result of collaboration between the two companies to address the specialized design and leading-edge manufacturing requirements of their mutual customers. The companies' on-going cooperation is focused on delivering a series of Laker-UMC PDKs that enable design teams to bring differentiated products to market faster.
Developed using SpringSoft's Laker Custom IC Design software, the Laker-UMC PDK supports the UMC 65nm CMOS standard logic process with mixed-mode technologies and low-k dielectrics. UMC's 65nm standard performance process enables designers to power a broad range of applications from consumer products to graphic ICs. Technology options can then be implemented including mixed signal/RFCMOS and embedded memories to further customize the process. The PDK includes device symbols, highly optimized parameterized cells (i.e., Laker MCells), pre-validated design rules and the latest technology files. The Laker-UMC 65nm CMOS PDK is available online for UMC customers.

"As a developer of digital television System-On-Chip solutions for the rapidly growing consumer electronics markets, we're faced with challenging time-to-market windows and relentless demand for more functionality at lower cost points with each new product generation," said Saeid Moshkelani, senior vice president of engineering at Trident Microsystems, Inc. "This puts extraordinary pressure on our development teams, and makes it imperative that they have access to world-class design tools and manufacturing technologies. The PDK collaboration by SpringSoft and UMC ensures that designers have the latest, most accurate information, so they can spend more time on innovation than implementation."
"UMC collaborates with EDA tool vendors to deliver design support solutions that help designers more easily produce layouts that are optimized for our manufacturing processes," said Stephen Fu, director of the IP Development & Design Support Division at UMC. "We applaud SpringSoft's diligence in supporting the needs of Laker users, and are very pleased with the results of our first jointly developed and qualified PDK for 65nm designs."

"The Laker user community spans a broad range of product applications, and their technology requirements are very often driven by the markets they serve. However, the basic challenge of simplifying the design implementation process is universal, which underscores the significance of our PDK efforts, "said Johnson Teng, chief operating officer of SpringSoft. "We've enjoyed a very productive working relationship with UMC, and look forward to expanding the line of Laker-UMC PDKs in the near future."

About The Laker Custom IC Design Solutions
The Laker Custom IC Design solutions offer the power of controllable automation and unmatched interoperability to achieve superior layout results with less effort for analog, mixed-signal, and custom digital designs. More than 300 companies worldwide, including 7 of the top 10 semiconductor companies, have adopted the Laker layout system for designs down to 45 nanometers. For more information about Laker products, visit: http://www.springsoft.com/product/

About SpringSoft
SpringSoft, Inc. is a global supplier of specialized automation technologies that accelerate engineers during the design, verification and debug of complex digital, analog and mixed-signal ICs, ASICs, microprocessors, and SoCs. Its award-winning product portfolio features the Novas Verification Enhancement and Laker Custom IC Design solutions used by more than 400 of today's leading IDM and fabless semiconductor companies, foundries, and electronic systems OEMs. Headquartered in Hsinchu, Taiwan, and San Jose, California, SpringSoft is the largest company in Asia specializing in IC design software and a recognized industry leader in customer service with more than 400 employees located in multiple R&D sites and local support offices around the world. For more information, visit www.springsoft.com.

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