Implementing Lead-free Workshop Tackles Assembly Problems

(October 11, 2006) NASHUA, N.H. — Manufacturers facing challenges with lead-free assembly and a host of associated system changes — certification, failure analysis, traceability — can attend Implementing Lead-free: A Hands-on Workshop, October 16 – 19, hosted by SMT Magazine and the Rochester Institute of Technology (RIT) Center for Electronics Manufacturing and Assembly (CEMA) in Rochester, N.Y.

Doug Peck will present a full-day lab on lead-free rework — focusing on lead-free alloys, board finishes, and inspection capabilities, in a hands-on atmosphere. Lecturers include Dennis Barbini, Ph.D.; Paul Vianco, Ph.D.; and other acclaimed industry professionals. Topics range from statistical process control (SPC) to lead-free surface finishes, with sessions on reflow and selective soldering.

Ron Lasky, Ph.D., PE, will walk attendants through lead-free implementation from A – Z on October 17^th. S.M. Ramkumar, a professor and director at RIT CEMA, will host the lab portion of this two-day workshop.

Dan Shea, CTO of Celestica, will keynote the event on Tuesday evening, speaking to the electronics industry's responsibility in "green" manufacturing. Jim Dills of the Goodbye Chain Group will deliver a keynote address to participants during lunch on October 18^th. The conference will conclude with a lecture on failure analysis and prevention methods from Viswam Puligandla, Ph.D.

With a comprehensive set of industry professionals delivering sessions, hands-on labs, lectures, and roundtable discussions, the Implementing Lead-free workshop will cover RoHS and lead-free from every angle.

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