Laminating Resins Withstand Lead-free Temperatures

(August 24, 2006) THE WOODLANDS, Texas — Huntsman Advanced Materials introduced two halogen-free laminating resins to comply with current regulatory requirements for PCB manufacturing. AZYRAL one- and two-component laminating systems produce a low dielectric constant, low dissipation factor, and volume and surface resistivity. They are said to be high-temperature resistant with good thermal stability, low coefficient of thermal expansion (CTE), and low shrinkage.

The combination of physical properties within the laminates is designed to withstand harsh operating conditions. The resin material is RoHS-compliant and suitable for lead-free soldering processes. It meets UL 94 V-O requirements. The systems also feature low viscosities for FR 4 processing and are non-dicy curing.

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