Philips introduces industry's first portfolio of 100% Lead-free small signal discretes in plastic surface mount devices

Aggressive conversion roadmap delivers lead-free products 2 years in advance of legislative requirements

Royal Philips Electronics (NYSE: PHG, AEX: PHI) today announced the availability of its entire portfolio of small signal discrete plastic surface mount devices (SMD) in 100% lead-free packaging. In these devices, the tin-lead-plating will be replaced by pure matte tin (100% Sn) to meet the strong market trend towards environmentally friendly products. The conversion of Philips' small signal discretes in plastic SMD will quickly be followed by the conversion of its entire product portfolio of glass and ceramic products to lead-free. This change takes place well in advance of new legislation mandating the manufacture of only lead-free products beginning July 2006, giving customers time to plan and test the new products accordingly.

In July 2001, Philips teamed up with STMicroelectronics and Infineon Technologies to develop a proposed standard for defining 'lead-free' and to develop proposed standards related to lead free products through assessment of factors such as solderability, reliability of alternative materials and characterization of the Moisture Sensitivity Level. Lead free, as defined by the companies, is content less than 1000 ppm lead by weight. Now Philips is leading the industry's drive toward a 100% lead-free supplier with the introduction of the lead-free plastic SMD portfolio.

"We have accelerated our drive to deliver 100% lead-free products with the introduction of our portfolio of small signal plastic SMD," said Frans Scheper, senior vice president, Philips Semiconductors. "We wanted to enable a smooth transition for our customers by providing forward and backward compatibility of the devices with the reliability they need, and in plenty of time to test and prepare for the legislation coming into effect. We are committed to delivering quality products that meet customer requirements and contribute to a cleaner, greener environment."

Electronic equipment contains only small amounts of lead, however, the sheer quantity of devices worldwide means that any reduction in lead content is another healthy step toward a cleaner environment. By substituting lead-based materials in components and packages, Philips is helping make the world a 'greener' place. Some older-style packages for IC and discrete components utilize tin-lead coated terminals to facilitate circuit board connection. Replacing this alloy with pure tin (100% Sn) plating creates a lead-free alternative that is fully forward and backward compatible with lead-based types, featuring the same size and electrical / mechanical characteristics - a key customer requirement. In addition, all current products have been re-qualified to update the portfolio with lead-free solutions that meet industrial standards.

For more information on Philips the availability of Philips lead-free products including the conversion roadmap, visit www.semiconductors.philips.com/green_roadmap.

Original text is here