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Electronic Engineering News Digest |
COMPONENT NEWS | INDUSTRY NEWS | RoHS/WEEE NEWS |
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According to an article by Mitch Holtzer of Cookson Electronics that appeared in SMT Online, tin/silver/copper (SAC) alloys have become the industry standard lead-free solders since RoHS went into effect. Holtzer notes that “technical and economic factors are reducing the silver content in SAC compositions, with disadvantages like slower wetting speeds, and advantages like minimized BGA voids.” He also points out that “solder choices are influenced by the desired results, cost, BOM, and other factors.”
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