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Electronic Engineering News Digest |
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According to an article in Electronics Weekly, a UK-based sister publication of Design News, a researcher at the UK’s University of Leicester has discovered detrimental voids in lead-free solder joints. The article quotes researcher Sergey Belyokov as noting that he “discovered a process which has not been described yet: the formation of crystallographically-faceted voids in the bulk of lead-free solders.”
The results are new and Belyakov only has preliminary results. “They are constantly observed. This is very undesirable effect which needs to be terminated,” says Belyakov. “At the moment I am trying to investigate the nature of this phenomenon to propose possible ways of avoiding it.”
Original text is here